WebOct 30, 2024 · The Direct Bond Interconnect (DBI® Ultra) technology is a low temperature die to wafer (D2W) and die to die (D2D) hybrid bonding technology that solves many challenges with pitch scaling in advanced packaging. The ability to scale to <; 1μm pitch while maintaining throughput comparable to the mass reflow flip chip process and … WebThe FC300 Flip-Chip Bonder is the newest generation of high accuracy and high force system for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications with ± 0.3 µm post-bonding accuracy.. The FC300 covers a large range of bonding forces, from 1 to 4000 N.That makes it perfectly suitable for reflow and thermocompression …
Sub-Micron Die Bonder - FINEPLACER® lambda 2 Finetech
WebThe Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability … Webflip-chip die bonder Datacon 8800 FC QUANTUM advanced. fully-automatic high-accuracy. As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets … datwyler production system
Semiconductor Manufacturing Equipment - SHIBAURA
WebFlip Chip. Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive … http://www.secengchina.com/product-item-10.html WebIn contrast, the chip surface with bonding pads are looking downward (Face-down) with flip chip assembly method. The bonding pads are connected to a substrate via solder bump, ACF and so on. Following benefits can be obtained with our laser assisted bonding machine for flip chip: Depress thermal stress that caused by long reflow time. bkb-sin sentence list